Raspberry Pi 6 Delayed to 2028 Amid DRAM Shortage; Microcontroller Volume Overtakes SBCs
Raspberry Pi has extended the release timeline for the Pi 6 to early 2028 due to global DRAM supply constraints, opting to focus on raw CPU and I/O scaling over specialized AI hardware. Meanwhile, the organization's microcontroller shipments have surpassed single-board computer sales, supported by the stabilization of the RP2350 platform.
Raspberry Pi 6 Roadmap and Silicon Strategy
- 2012: Raspberry Pi
- 2015: Raspberry Pi 2 (+3 years)
- 2016: Raspberry Pi 3 (+1 year)
- 2019: Raspberry Pi 4 (+3 years)
- 2023: Raspberry Pi 5 (+4 years)
The primary driver behind this timeline adjustment is a global DRAM shortage. Introducing a new architecture under current market conditions threatens the standard pricing model, as the organization aims to avoid releasing an SBC that doubles the $50 price point of the Raspberry Pi 5. Consequently, the Raspberry Pi 5 will remain the flagship hardware platform for the medium term.
When the Raspberry Pi 6 does debut, the architecture will focus on raw performance scaling rather than expanding peripheral interfaces. Engineers indicate that the design will prioritize a faster CPU and enhanced I/O throughput. Users expecting a built-in M.2 slot or a higher port count will need to adjust expectations. Furthermore, the platform will omit a dedicated Neural Processing Unit (NPU). The design team views the primary host CPU as the optimal engine for AI compute, choosing to avoid dedicating silicon area to specialized AI accelerators.
Pi Zero Supply Chains and Legacy Hardware Volume
Production of the Raspberry Pi Zero 2 W faces ongoing constraints due to substrate supply shortages. High demand for AI silicon has saturated manufacturing capacity, forcing older chips on legacy process nodes to compete for raw wafer allocations. To mitigate these supply limitations, Raspberry Pi is currently onboarding a secondary vendor to increase production capacity.
- PCB Design Limitations: Transitioning to a faster CPU would require abandoning the low-cost, single-sided PCB design. The current package-on-package (PoP) method of stacking RAM directly on top of the CPU is incompatible with the thermal and signaling requirements of higher-performance processors.
- Memory Cost Constraints: Modern LPDDR memory prices prevent the bill of materials (BOM) from aligning with the target $15 retail price. The current Zero 2 W maintains this price point solely by leveraging an existing stockpile of older LPDDR2 RAM.
Concurrently, demand for legacy hardware remains robust. The Raspberry Pi 3B, which was released over a decade ago, continues to serve as a high-volume, lower-cost alternative to the Pi 4 and Pi 5, maintaining consistent sales of nearly one million units annually.
Microcontroller Dominance and RP2350 Revisions
In 2025, Raspberry Pi's microcontroller (MCU) shipments officially surpassed its SBC sales volume. This volume divergence is expected to widen as SBC pricing continues an upward trend.
The development of the RP2350 microcontroller faced significant challenges regarding power consumption and security. These issues were resolved prior to mass production via a new silicon stepping (revision) that successfully mitigated a critical current leakage bug.
Physical layer design decisions for the Pico line continue to prioritize strict cost and space targets. The retention of micro-USB interfaces over USB-C is dictated by component-level economics and board layout constraints; USB-C connectors demand a premium price and require a larger physical footprint on the PCB. However, a transition to USB-C remains on the long-term roadmap.
Firmware Commitments and Software Engineering Allocation
The organizational strategy places hardware utility as a direct function of software maturity. Raspberry Pi's CTO of Software Engineering, Gordon Hollingworth, has committed 95% of the software division's engineering hours directly to the maintenance, support, and development of fundamental libraries, device drivers, kernels, and operating systems. This heavy allocation toward low-level software infrastructure is positioned as the primary differentiator against competing embedded hardware vendors, sustaining product adoption despite extended hardware release cycles.